Theodosia Gougousi

Theodosia GougousiContact Information

gougousi@umbc.edu 
410-455-6874
Physics, Rm 317

Research Pages

Title

Professor

Education

Ph.D. Physics – University of Pittsburgh, 1996
M.Sc. Physics – University of Pittsburgh, 1993
B.S. Physics – Aristotle University of Thessaloniki, GREECE, 1990

Previous Experience

Dr. Gougousi joined UMBC after postdoctoral appointments at North Carolina State University and the University of Maryland College Park.

Professional Interests

My research focuses on nanostructured materials, thin films, and interfaces. As modern devices continue to shrink toward the atomic scale, surfaces and interfaces often become the key factors that determine performance. Understanding how these interfaces form, evolve, and influence material behavior is one of the central challenges in advanced materials science.
My group studies how thin films and other low-dimensional materials grow, and how their structure affects their properties. Over the years, our work has included dielectrics, semiconductors, photonic materials, and two-dimensional materials such as transition metal dichalcogenides. We use both chemical methods, including Atomic Layer Deposition (ALD), and physical vapor deposition techniques to grow materials on a wide range of substrates and to study their structural, electronic, and optical behavior.
A major emphasis of our research is Atomic Layer Deposition, a method for building materials one atomic layer at a time. ALD offers exceptional control over thickness, composition, and morphology, and can produce smooth, uniform, conformal coatings even on complex three-dimensional surfaces. What makes ALD especially powerful is that film growth occurs through alternating surface reactions that are self-limiting and repeatable. Because the process depends strongly on surface chemistry, it can also be used for selective deposition. This opens new possibilities for bottom-up fabrication of nanoscale structures and for designing materials with tailored functionality.

Atomic layer deposition permits atomic level of the film thickness and morphology and achieves very smooth, uniform, conformal films even on very high aspect ratio structures. Although ALD is usually thought of as a modified version of Chemical Vapor Deposition (CVD), it exhibits some unique features:  film formation is achieved by alternating exposure of a surface to the vapor of two chemical reagents that react in a complementary, self-limiting manner. Complementary means that each of the two reagents must prepare the surface for reaction with the other chemical so the process is cyclical. The dependence of the deposition on favorable surface chemistry can be exploited to achieve selective deposition that is the basis of the so-called “bottom-up” approaches for the formation of nanostructures.

Publications

Theodosia Gougousi’s publications and citations (Google Scholar)

A photograph showing five thin-film samples resting on white liners inside a clear plastic storage case. On the left side of the case is a single, large rectangular film with a golden-yellow hue. On the right side, four smaller rectangular film samples are grouped together, displaying distinct colors including vibrant light blue, deep violet-blue, and olive green. A pair of lab tweezers is partially visible in the upper right corner, indicating the small scale of the materials.
Nitrogen-doped TiO₂ thin films with strong nonlinear optical properties. Color differences reflect differences in composition.
Two side-by-side microscopic images of MoS2 monolayer flakes. The left image shows a wide field of view with numerous small, dark triangular shapes scattered across a reddish-purple surface. The right image is a high-magnification atomic force microscopy (AFM) scan in shades of orange and brown, showing a close-up of several overlapping triangular flakes. A scale bar at the bottom of the right image indicates a width of 5.0 micrometers.
AFM images of MoS₂ monolayer flakes. Typical thickness: 0.7 nm.